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--- | ||
title: Ordering | ||
prev: /docs/manufacturing | ||
next: /docs/manufacturing/reflow_soldering | ||
weight: 1 | ||
params: | ||
icon: cog | ||
--- | ||
|
||
> [!NOTE] | ||
> All prices are listed in $USD. | ||
## JLCPCB | ||
### Single board design | ||
- 0.8mm thickness | ||
- 4 layers | ||
- 120mm by 80mm | ||
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||
| Part | Cost | | ||
| --- | --- | | ||
| Base | $2.00 | | ||
| 4 layer 0.8mm stackup required HASL finish | $4.80 | | ||
| 4 layer stackup above 50mmx50mm | $5.00 | | ||
| Engineering cost of boards above 100mmx100m | $24.00 | | ||
| **Total** | **$35.80** | | ||
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||
### Flexible PCB design | ||
#### M.2 card | ||
- 0.8mm thickness | ||
- 4 layers | ||
- 22mm x 42mm | ||
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||
| Part | Cost | | ||
| --- | --- | | ||
| Base | $2.00 | | ||
| 4 layer 0.8mm stackup required HASL finish | $4.80 | | ||
| **Total** | **$6.80** | | ||
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||
#### Oculink port board | ||
- 1.6mm thickness | ||
- 4 layers | ||
- 87mm x 21mm | ||
|
||
| Part | Cost | | ||
| --- | --- | | ||
| Base | $2.00 | | ||
| 4 layer stackup above 50mmx50mm | $5.00 | | ||
| **Total** | **$7.00** | | ||
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#### Flexible PCB | ||
- 0.11mm thickness | ||
- 2 layers | ||
- 83mm by 77mm | ||
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||
| Part | Cost | | ||
| --- | --- | | ||
| Base | $2.00 | | ||
| **Total** | **$2.00** | | ||
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#### Total cost of all boards | ||
| Board | Cost | | ||
| --- | --- | | ||
| M.2 card | $6.80 | | ||
| Oculink port board | $7.00 | | ||
| Flexible PCB | $2.00 | | ||
| **Total** | **$15.80** | | ||
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## Components | ||
The components for both the single board design and multi-board flexible PCB design are identical. | ||
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||
| Part | Unit Cost | Quantity | Total | | ||
| --- | --- | --- | --- | | ||
| Amphenol Oculink port <br>(G14A42121B12HR) | $3.50 | 1 | $3.50 | | ||
| SOD52 Schottky diode | $0.25 | 1 | $0.25 | | ||
| X7R 040 10nF MLCC | $0.05 | 5 | $0.25 | | ||
| **Total** | | | **$4.00** | | ||
|
||
- Components were ordered from [Mouser Australia](https://au.mouser.com/). | ||
- There are minimum order quantities for the Oculink port connector which has a MOQ of 5. | ||
- Price of extra components are not considered since we are just interested in cost of a completed M.2 to Oculink adapter board. |
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--- | ||
title: Reflow soldering | ||
prev: /docs/manufacturing/jlcpcb | ||
prev: /docs/manufacturing/ordering | ||
next: /docs/manufacturing/electrical_testing | ||
weight: 2 | ||
params: | ||
icon: fire | ||
--- | ||
|
||
## Equipment | ||
- Reflow plate | ||
- Soldering iron | ||
- Magnifying glass | ||
- Isopropyl alcohol | ||
- Reflow soldering plate. | ||
- Soldering iron with a conical tip. | ||
- Magnifying glass. | ||
- Isopropyl alcohol. | ||
- Metal tweezers. | ||
|
||
## Reflow oculink port | ||
- Apply stencil for oculink connector, make sure there are no bridges | ||
- Place oculink port | ||
- Apply reflow | ||
{{< responsive_image key="mechanic_ix5_reflow" style="width: 50%" >}} | ||
{{< responsive_image key="ts100_soldering_iron" style="width: 50%" >}} | ||
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## SMD components | ||
- Can apply stencil | ||
- Easier to solder by hand | ||
## Reflow profile | ||
1. Set a target temperature on the Mechanic IX5 reflow plate. | ||
2. Activate the reflow process which will increase the temperate by 1°C each second until target temperature is reached. | ||
3. Once the reflow temperature is reached let it remain at this temperature until reflow has finished. | ||
4. Allow the PCB to cool which decrease temperature by 1°C each second until it is cool enough to handle. | ||
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||
## FFC connector for flex pcb | ||
- Need to apply pressure to connector while reflow occurs for complete contact | ||
- There is not alot of tolerate for FFC connector when soldered since there is mechanical slack, it has to be as flat to the SMD pads as possible | ||
- When reflowing connector place weights to apply even pressure across FFC connector | ||
{{< responsive_image key="reflow_profile" >}} | ||
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The Mechanic IX5 can be used to follow an arbitrary reflow profile (including the shown trapezoidal or delta types). The delta type reflow profile is sufficient for the Oculink port. | ||
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## Instructions | ||
### Reflow soldering components | ||
1. Apply stencil for Oculink connector and capacitors to spread solder paste. | ||
2. Visually check to make sure there are no bridges or missing solder paste on SMD pads. | ||
3. Place oculink port carefully onto SMD pads as to align them correctly. | ||
4. Follow reflow profile with a target temperature of 220°C and keep it there for 60 seconds before ramping it down. | ||
5. Visually confirm that there are no solder bridges on visible connections. | ||
6. Validate that there are no shorts or bad connections following [electrical testing]({{< abs_url link="/docs/manufacturing/electrical_testing" >}}). | ||
- Due to simple design of circuit the complications should only occur with the Oculink port itself. | ||
- Here excessive or insufficient solder paste can result in short circuits or a missing electrical connection. | ||
- Repeat steps 1 to 5 until the Oculink port is soldered correctly. | ||
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||
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For the flexible PCB design continue to the following instructions below. | ||
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### Soldering flex connector | ||
This process is only required for the two part board which is connected over the flexible PCB. | ||
|
||
1. Perform reflow soldering of components for each of the two boards as described above. | ||
2. Tin the SMD connection pads on both the flexible PCB and M2 card and Oculink port board. | ||
- Make sure that there is a minimal amount of solder to prevent shorts when reflow soldering connector. | ||
- Check to see if amount of solder has same height across all pads. If there isn't remove it until it is level. | ||
3. Focus on the Oculink port board first and preheat it to 140°C. | ||
4. Preheat the soldering iron with the conical tip to 280°C. | ||
5. Using metal tweezers carefully position the flexible connector to align with the SMD pads. | ||
- Add flux to the flexible connector and board will help keep the connector in place once aligned. | ||
- Do this under a magnifying glass with mechanical helper hands. | ||
6. Using the soldering iron solder the ground SMD pads after alignment. | ||
- Be careful to not misalign the connector. | ||
- Increase the preheating temperature of the board to 150°C or above if soldering isn't occuring. | ||
- Avoid preheating the board to too high of a temperature otherwise solder may become molten and components and Oculink port can be knocked off. | ||
- Avoid keeping the board preheated for too long otherwise PCB will discolour. | ||
- Make sure that you have soldered enough of the ground pads to keep the connector in place. | ||
7. Let the Oculink port board cool down and check that flexible PCB is **mechanically** secure enough to move assembly around. | ||
- At this step there is no sound electrical connection between the board and flexible PCB. | ||
- We only need it to be mechanically secure so we can perform the full reflow step under mechanical pressure. | ||
8. Place a weight on top of the flexible PCB connection to equally apply force on the SMD pads. | ||
- The weight should cover the entire flexible PCB connection pads. | ||
- The weight should not melt at the reflow temperature of 220°C. | ||
- The weight should be secure and stationary during reflow process. | ||
9. Perform reflow soldering of the flexible PCB connection while the connections are under constant force. | ||
- Since there are no spring contacts, the z-height tolerance of the connection is very low. | ||
- To guarantee a good electrical connection the reflow process has to occur while the pads are under compressive pressure. | ||
- Be careful not to disturb the existing connections such as the Oculink port and capacitors. | ||
10. Perform electrical tests as described in [electrical testing]({{< abs_url link="/docs/manufacturing/electrical_testing" >}}). | ||
- This is done to make sure shorts don't occur due at the flexible PCB connection with the Oculink port board. | ||
- If shorts do occur at this step repeat steps 1 to 10 with less solder on the pads. | ||
- If these is a missing electrical connection make sure that sufficient pressure has been applied during reflow. | ||
11. Repeat setps 1 to 10 for the M.2 card. |
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