Skip to content

Soldering and assembling

Jump to bottom
Dilshan R Jayakody edited this page Oct 31, 2021 · 7 revisions

The 5.1 preamplifier board uses both surface-mounted and through-hole type components. To minimize soldering difficulties, we recommended soldering all the SMD components at the beginning.

The most recommended soldering order lists in below:

  1. PIC16F886 MCU (U4)
  2. TL074 and TL072 operational amplifier ICs (U6, U7, U8, and U9)
  3. All SMD resistors and ceramic capacitors
  4. SMD electrolytic capacitors
  5. Three ground isolation jumpers (R1, R2, and R3)
  6. All through-hole type resistors
  7. SMD trimpot (RV1)
  8. Mylar capacitors
  9. JST connectors and pin headers
  10. PT2258 IC or 20-pin IC socket (U5)
  11. LM317, LM337, and uA7805 regulators with heatsink (U1, U2, and U3)
  12. Through-hole type Electrolytic capacitors
  13. Transformer cables (J1)
  14. Audio input and output cables

Heatsink

In our prototype, we use a custom heatsink for all the voltage regulators. The recommended heatsink (front) layout is as follows:

Heatsink layout

To construct this heatsink, we use a generally available 2.5mm, flat Aluminum bar.

Clone this wiki locally