The 10-Inch Rack PDU (Power Distribution Unit) is a modular power management system designed for efficient control and monitoring of power in a rack-mounted environment. The project includes a controller board, a display board, and a relay board to handle switching and power management.
| Phase | Status |
|---|---|
| PCB Design & Prototyping |  |
| Enclosure Design | |
| Order PCB |  |
| Prototyping and Hardware Testing |  |
| Initial Firmware Development | |
| Enclosure Testing & Ventilation | |
| Web-Based UI for Control |  |
| Power Logging & Alerts | |
| Production Optimization | |
- Controller Board: Handles Ethernet communication, power conversion, and system logic.
- Display Board: Provides user interaction with OLED display and status LEDs.
- Relay Board: Manages AC switching with 8x 230V relays, fuses, and safety isolation.
- Ethernet Connectivity: Uses the W5500 SPI-based Ethernet chip for remote control and monitoring.
- Power Measurement: AC voltage and current sensing for real-time monitoring.
- 3D Printed Enclosure: Designed for 10-inch rack mounting with front and rear access.
- Input Voltage: 230V AC, 10A max
- Internal Power Supply: 12V, 1.5A SMPS
- Derived Voltages: 5V and 3.3V regulated from 12V
- Relay Supply: 12V dedicated for relay operation
- Common AC Trace Handling: 16A max
- Per-Relay Trace Rating: 15A max
- Relay Contact Rating: 16A max
- Relay Driver: ULN2803 Darlington Array
- Driving Current: 33mA per relay
- Current Limit Resistor: Configured for 35mA max per relay coil
- Relay Board: 2-layer PCB.
- Display Board: 2-layer PCB.
- Controller Board: 4-layer PCB (JLC04161H-3313, 1.56mm ±10% thickness)
| Impedance (Ω) | Type | Signal | Bottom | Trace Width (mm) | Trace Spacing (mm) |
|---|---|---|---|---|---|
| 90 | Differential Pair (Non-coplanar) | L1 | L2 | 0.1549 | 0.1905 |
| 100 | Differential Pair (Non-coplanar) | L1 | L2 | 0.1209 | 0.1905 |
| Layer | Material | Thickness (mm) |
|---|---|---|
| L1 (SIG) | Outer Copper Weight 1oz | 0.0350 |
| Prepreg | 3313 RC57% 4.2mil | 0.0994 |
| L2 (GND) | Inner Copper Weight | 0.0152 |
| Core | 1.3mm H/HOZ with copper | 1.2650 |
| L3 (GND) | Inner Copper Weight | 0.0152 |
| Prepreg | 3313 RC57% 4.2mil | 0.0994 |
| L4 (SIG) | Outer Copper Weight 1oz | 0.0350 |
The full schematics for each board are available:
- Setup the hardware by assembling the three boards.
- Power on the system and configure settings via the display or Ethernet interface.
- Monitor and control relay switching and power parameters.
- Ventilation Testing & Optimization: Evaluate enclosure thermals and, if needed, add passive or active cooling.
- Firmware Development: Implement remote control and monitoring via Ethernet.
- Web-Based UI: A browser-accessible interface for managing power outputs.
- Metal Enclosure: If production scales up, explore CNC or sheet-metal enclosures.
This project is licensed under the GPL-3.0 License. See the LICENSE file for details.
For questions or feedback:
- Email: s.dvid@hotmail.com
- GitHub: DvidMakesThings
